Taiwanese IC Packaging & Testing Industry, 4Q 2017
- Report Description Table of Contents
The report finds that shipment value of the Taiwanese IC packaging and testing industry enjoyed both year-on-year and sequential growth in the third quarter of 2017, to nearly USD 3.7 billion. The industry is forecast to have continued growing year-on-year in the fourth quarter of 2017. Overall, the industry still managed to grow over 8% in 2017 compared to last year.
List of Topics
- This research report presents shipment value forecast and recent quarter review of the Taiwanese IC packaging and testing industry.
- Companies surveyed in this research are contract manufacturers focusing on IC packaging and testing for IC suppliers around the world.
- The content of this report is based on primary data obtained from interviews, and publicly available information.
Ardentec, ASE, Chipbond, ChipMOS, FATC, KYEC, OSE, PTI, Sigurd, SPIL, Walton